V58C2256804S-T75
Снят с производства
Краткое описание:
DRAM 256Mbit 8Mx8 DDR SDRAM 2.5V 60-Pin TSOP-II SMT
Дополнительная информация
256M bit DDR SDRAM memory chip, organized as 8Mx8, featuring an 8-bit data bus width and a maximum clock rate of 266 MHz. This surface-mount component utilizes a 60-pin TSOP-II package with gull-wing leads, measuring 22.22mm in length and 10.16mm in width, with a 0.65mm pin pitch. Operating at a typical supply voltage of 2.5V, it offers 4 internal banks and a maximum access time of 0.75 ns, suitable for applications within a 0°C to 70°C temperature range.
| PCB | 60 |
| ECCN | EAR99 |
| Type | DDR SDRAM |
| Density | 256Mbit |
| HTS Code | 8542320024 |
| Mounting | Surface Mount |
| Cage Code | SFP67 |
| Pin Count | 60 |
| Lead Shape | Gull-wing |
| Schedule B | 8542320015 |
| Organization | 8Mx8 |
| Package/Case | TSOP-II |
| RoHS Versions | 2002/95/EC |
| Data Bus Width | 8bit |
| Pin Pitch (mm) | 0.65 |
| Density in Bits | 268435456bit |
| Package Material | Plastic |
| Address Bus Width | 15bit |
| Basic Package Type | Lead-Frame SMT |
| Maximum Clock Rate | 266MHz |
| Package Width (mm) | 10.16 |
| Maximum Access Time | 0.75ns |
| Package Description | Thin Small Outline Package (Type II) |
| Package Family Name | SOP |
| Package Height (mm) | 1 |
| Package Length (mm) | 22.22 |
| Radiation Hardening | No |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 2M |
| Seated Plane Height (mm) | 1.2(Max) |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 300mA |
| Min Operating Temperature | 0°C |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
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