W3DG648V75D2

W3DG648V75D2 - Microchip
Краткое описание: DRAM Module 64MB SDRAM 133MHz 168-DIMM 3.3V
Производитель Microchip

Дополнительная информация

64MB SDRAM DIMM module featuring 168 pins and a 64-bit data bus width. Organized as 8Mx64 with 8 chips per module, each chip is 64M bit and configured as 4Mx16. This unbuffered dual in-line memory module operates at a maximum clock rate of 133 MHz with a CAS latency of 3, utilizing a 3.3V supply voltage. The non-lead-frame SMT package measures 133.48mm (Max) in length and 3.81mm (Max) in width, designed for socket mounting.
PCB 168
ECCN EAR99
PPAP No
HTS Code 8473301140
Mounting Socket
Cage Code 60991
Pin Count 168
Automotive No
Lead Shape No Lead
Schedule B 8473300002
CAS Latency 3
ECC Support No
Module Type 168DIMM
Subcategory SDRAM
Chip Density 64Mbit
Organization 8Mx64
Package/Case UDIMM
AEC Qualified No
Main Category DRAM Module
Total Density 64Mbyte
Data Bus Width 64bit
Chip Package Type TSOP
Basic Package Type Non-Lead-Frame SMT
Chip Configuration 4Mx16
Maximum Clock Rate 133MHz
Package Width (mm) 3.81(Max)
Package Description Unbuffered Dual In Line Memory Module
Package Family Name DIM
Package Height (mm) 25.4
Package Length (mm) 133.48(Max)
Max Operating Temperature 70°C
Maximum Operating Current 650mA
Min Operating Temperature 0°C
Number of Chip per Module 8
Max Operating Supply Voltage 3.6V
Min Operating Supply Voltage 3V
Typical Operating Supply Voltage 3.3V

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