W3EG6432S202D4I
Краткое описание:
DRAM Module 256MB DDR SDRAM 200-Pin USODIMM 200MHz
Дополнительная информация
256Mbyte DDR SDRAM DRAM Module, 200-pin USODIMM, 200 MHz clock rate, 0.75 ns access time, 64-bit data bus width, and 2 CAS latency. Features 8 x 256M bit TSOP chips organized as 32Mx64 (32Mx8 chip configuration). Operates with a 2.5V supply voltage (2.3V-2.7V range) and has a maximum operating current of 2800 mA. Designed for socket mounting with a non-lead-frame SMT basic package type, measuring 67.56mm (max) length, 3.81mm (max) width, and 31.75mm height. Supports a temperature range of -40°C to 85°C.
| PCB | 200 |
| ECCN | 4A994.a |
| PPAP | No |
| EU RoHS | No |
| HTS Code | 8473301140 |
| Mounting | Socket |
| Cage Code | 60991 |
| Pin Count | 200 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8473300002 |
| CAS Latency | 2 |
| ECC Support | No |
| Module Type | 200SODIMM |
| Subcategory | DDR SDRAM |
| Chip Density | 256Mbit |
| Organization | 32Mx64 |
| Package/Case | USODIMM |
| AEC Qualified | No |
| Main Category | DRAM Module |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Total Density | 256Mbyte |
| Data Bus Width | 64bit |
| Chip Package Type | TSOP |
| Basic Package Type | Non-Lead-Frame SMT |
| Chip Configuration | 32Mx8 |
| Maximum Clock Rate | 200MHz |
| Package Width (mm) | 3.81(Max) |
| Maximum Access Time | 0.75ns |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 31.75 |
| Package Length (mm) | 67.56(Max) |
| Max Operating Temperature | 85°C |
| Maximum Operating Current | 2800mA |
| Min Operating Temperature | -40°C |
| Number of Chip per Module | 8 |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Supply Voltage | 2.3V |
| Typical Operating Supply Voltage | 2.5V |
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