W3EG6432S335D4

W3EG6432S335D4 - Microchip
Краткое описание: DDR SDRAM 256MB 333MHz 200-pin USODIMM Module
Производитель Microchip

Дополнительная информация

256Mbyte DDR SDRAM SODIMM module featuring a 200-pin USODIMM package with a 67.56mm maximum length and 3.81mm maximum width. This unbuffered memory module operates at a maximum clock rate of 333 MHz with a 0.7 ns maximum access time, utilizing a 64-bit data bus width. The module is organized as 32Mx64, with 8 chips per module, each configured as 32Mx8 TSOP. It operates with a typical supply voltage of 2.5V, a CAS latency of 2.5, and supports a temperature range of 0°C to 70°C.
PCB 200
ECCN EAR99
PPAP No
EU RoHS No
HTS Code 8473301140
Mounting Socket
Cage Code 60991
Pin Count 200
Automotive No
Lead Shape No Lead
Schedule B 8473300002
CAS Latency 2.5
ECC Support No
Module Type 200SODIMM
Subcategory DDR SDRAM
Chip Density 256Mbit
Organization 32Mx64
Package/Case USODIMM
AEC Qualified No
Main Category DRAM Module
RoHS Versions 2011/65/EU, 2015/863
Total Density 256Mbyte
Data Bus Width 64bit
Chip Package Type TSOP
Basic Package Type Non-Lead-Frame SMT
Chip Configuration 32Mx8
Maximum Clock Rate 333MHz
Package Width (mm) 3.81(Max)
Maximum Access Time 0.7ns
Package Description Unbuffered Small Outline Dual In Line Memory Module
Package Family Name DIM
Package Height (mm) 31.75
Package Length (mm) 67.56(Max)
Max Operating Temperature 70°C
Maximum Operating Current 3280mA
Min Operating Temperature 0°C
Number of Chip per Module 8
Max Operating Supply Voltage 2.7V
Min Operating Supply Voltage 2.3V
Typical Operating Supply Voltage 2.5V

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