WED3DG638V7D2I
Дополнительная информация
| PCB | 168 |
| ECCN | 4A994.a |
| PPAP | No |
| HTS Code | 8473301140 |
| Mounting | Socket |
| Cage Code | 60991 |
| Pin Count | 168 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8473300002 |
| CAS Latency | 2 |
| ECC Support | No |
| Module Type | 168DIMM |
| Subcategory | SDRAM |
| Chip Density | 64Mbit |
| Organization | 8Mx64 |
| Package/Case | UDIMM |
| AEC Qualified | No |
| Main Category | DRAM Module |
| Total Density | 64Mbyte |
| Data Bus Width | 64bit |
| Chip Package Type | TSOP |
| Basic Package Type | Non-Lead-Frame SMT |
| Chip Configuration | 4Mx16 |
| Maximum Clock Rate | 133MHz |
| Package Width (mm) | 3.81(Max) |
| Package Description | Unbuffered Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 25.4 |
| Package Length (mm) | 133.48(Max) |
| Max Operating Temperature | 85°C |
| Maximum Operating Current | 650mA |
| Min Operating Temperature | -40°C |
| Number of Chip per Module | 8 |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Supply Voltage | 3V |
| Typical Operating Supply Voltage | 3.3V |
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