WED3DG6466V75AD1
Краткое описание:
DRAM Module 512MB SDRAM 133MHz 64-bit 144SODIMM 3.3V
Дополнительная информация
512Mbyte SDRAM module featuring a 144-pin USODIMM package for socket mounting. This unbuffered small outline dual in-line memory module operates at a maximum clock rate of 133 MHz with a 5.4 ns access time. The organization is 64Mx64, utilizing 8 chips per module, each with a 512M bit density and TSOP package type. It operates with a typical supply voltage of 3.3V and supports a CAS latency of 3.
| PCB | 144 |
| ECCN | EAR99 |
| PPAP | No |
| EU RoHS | No |
| HTS Code | 8473301140 |
| Mounting | Socket |
| Cage Code | 60991 |
| Pin Count | 144 |
| Automotive | No |
| Lead Shape | No Lead |
| Schedule B | 8473300002 |
| CAS Latency | 3 |
| ECC Support | No |
| Module Type | 144SODIMM |
| Subcategory | SDRAM |
| Chip Density | 512Mbit |
| Organization | 64Mx64 |
| Package/Case | USODIMM |
| AEC Qualified | No |
| Main Category | DRAM Module |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Total Density | 512Mbyte |
| Data Bus Width | 64bit |
| Chip Package Type | TSOP |
| Basic Package Type | Non-Lead-Frame SMT |
| Chip Configuration | 64Mx8 |
| Maximum Clock Rate | 133MHz |
| Package Width (mm) | 3.81(Max) |
| Maximum Access Time | 5.4ns |
| Package Description | Unbuffered Small Outline Dual In Line Memory Module |
| Package Family Name | DIM |
| Package Height (mm) | 27.94(Max) |
| Package Length (mm) | 67.72(Max) |
| Max Operating Temperature | 70°C |
| Maximum Operating Current | 1200mA |
| Min Operating Temperature | 0°C |
| Number of Chip per Module | 8 |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Supply Voltage | 3V |
| Typical Operating Supply Voltage | 3.3V |
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