XC6SLX150-3FG676C
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Краткое описание:
FPGA 147K Logic Cells, 498 I/Os, 4824K RAM, 3.2Gbps Transceiver, 676-Pin FBGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. Features 4,824 Kbit RAM bits, 360 (18x18) multipliers, and 180 dedicated DSP slices. Offers 498 maximum user I/Os and 18 DLLs/PLLs. This surface-mount device is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package measuring 27x27x1.73mm with a 1mm pin pitch. Operates within a temperature range of 0°C to 85°C.
| PCB | 676 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAL-1 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 4824Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 180 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 147443 |
| Package Width (mm) | 27 |
| Process Technology | 45nm |
| Number of Registers | 184304 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.73 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 360 (18x18) |
| Seated Plane Height (mm) | 2.23 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 268 |
| Device Number of DLLs/PLLs | 18 |
| Maximum Number of User I/Os | 498 |
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