XC6SLX150-3FGG676C
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FPGA Spartan-6 LX 147K Logic Cells 498 I/O 3.2Gbps 676-Pin FBGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. This device features 4,824 Kbit of RAM, 360 integrated 18x18 multipliers, and 180 dedicated DSP slices. It offers 498 maximum user I/Os and supports transceiver speeds up to 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, it is designed for surface mounting and operates within a temperature range of 0°C to 85°C.
| PCB | 676 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 4824Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 180 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 147443 |
| Package Width (mm) | 27 |
| Process Technology | 45nm |
| Number of Registers | 184304 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.73 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 360 (18x18) |
| Seated Plane Height (mm) | 2.23 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 268 |
| Device Number of DLLs/PLLs | 18 |
| Maximum Number of User I/Os | 498 |
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