XC6SLX150-3FGG900I
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Краткое описание:
FPGA 147K Logic Cells 45nm 900-Pin FBGA 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. This surface-mount device utilizes a 900-pin Fine Pitch Ball Grid Array (FBGA) package measuring 31x31x1.75mm with a 1mm pin pitch. Operates across a temperature range of -40°C to 100°C, offering 576 maximum user I/Os and 3.2 Gbps transceiver speed.
| PCB | 900 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAN-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 4824Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 180 |
| RoHS Versions | 2011/65/EU |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 147443 |
| Package Width (mm) | 31 |
| Process Technology | 45nm |
| Number of Registers | 184304 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 360 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 268 |
| Device Number of DLLs/PLLs | 18 |
| Maximum Number of User I/Os | 576 |
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