XC6SLX16-2FGG900I
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Краткое описание:
FPGA Spartan-6 LX, 14.5K Cells, 45nm, 900-Pin FBGA, 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576Kbit RAM, 64 (18x18) multipliers, and 32 dedicated DSP blocks. Operates at 1.2V with a transceiver speed of 3.2 Gbps. Housed in a 900-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 31mm x 31mm x 1.75mm, suitable for surface mount applications. Supports a wide operating temperature range from -40°C to 100°C.
| PCB | 900 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 576Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 2 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 32 |
| RoHS Versions | 2011/65/EU |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 14579 |
| Package Width (mm) | 31 |
| Process Technology | 45nm |
| Number of Registers | 18224 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 64 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 32 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 576 |
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