XC6SLX16-3CSG225I
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Краткое описание:
FPGA Spartan-6 LX 14.5K Logic Cells 45nm 225-Pin CSBGA
Дополнительная информация
Field Programmable Gate Array (FPGA) featuring 14,579 logic cells and 18,224 registers, built on 45nm process technology. This device offers 576 Kbit of RAM, 64 integrated 18x18 multipliers, and 32 dedicated DSP blocks. It supports transceiver speeds up to 3.2 Gbps and includes 32 Block RAMs and 6 DLLs/PLLs. The FPGA is housed in a 225-pin Chip Scale Ball Grid Array (CSBGA) package with a 0.8mm pin pitch, designed for surface mounting. Operating temperature range is -40 °C to 100 °C.
| PCB | 225 |
| ECCN | EAR99 |
| PPAP | No |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 576Kbit |
| Cage Code | 68994 |
| Pin Count | 225 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 3 |
| Package/Case | CSBGA |
| AEC Qualified | No |
| Dedicated DSP | 32 |
| RoHS Versions | 2002/95/EC |
| Pin Pitch (mm) | 0.8 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 14579 |
| Package Width (mm) | 13 |
| Process Technology | 45nm |
| Number of Registers | 18224 |
| Package Description | Chip Scale Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 0.9 |
| Package Length (mm) | 13 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 64 (18x18) |
| Seated Plane Height (mm) | 1.4(Max) |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 32 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 160 |
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