XC6SLX16-3CSG324I

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XC6SLX16-3CSG324I - Xilinx
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Краткое описание: FPGA 14.5K Cells 45nm 324-Pin CSBGA 3.2Gbps Transceiver
Производитель Xilinx
Категория Интегральные схемы (ИС)
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576 Kbit RAM, 64 18x18 multipliers, and 32 dedicated DSP blocks. Offers 232 maximum user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Operates with a transceiver speed of 3.2 Gbps and includes 6 DLLs/PLLs. Packaged in a 324-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, suitable for surface mounting. Extended operating temperature range from -40°C to 100°C.
PCB 324
ECCN 3A991.d
PPAP No
Jedec MO-275KKAB-1
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 576Kbit
Cage Code 68994
Pin Count 324
Automotive No
Lead Shape Ball
Schedule B 8542390000
Family Name Spartan®-6 LX
Speed Grade 3
Package/Case CSBGA
AEC Qualified No
Dedicated DSP 32
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 0.8
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 14579
Package Width (mm) 15
Process Technology 45nm
Number of Registers 18224
Package Description Chip Scale Ball Grid Array
Package Family Name BGA
Package Height (mm) 0.9
Package Length (mm) 15
Package Orientation Yes
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 64 (18x18)
Seated Plane Height (mm) 1.5(Max)
External Memory Interface DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Total Number of Block RAM 32
Device Number of DLLs/PLLs 6
Maximum Number of User I/Os 232
Package Orientation Marking Type Dot

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