XC6SLX25-2FGG484C
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Краткое описание:
FPGA 24051 Cells 45nm 484-Pin FBGA 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit of RAM, 38 dedicated 18x18 multipliers, and 38 dedicated DSP blocks. Offers 266 maximum user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
| PCB | 484 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAJ-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 936Kbit |
| Cage Code | 68994 |
| Pin Count | 484 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 2 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 38 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 24051 |
| Package Width (mm) | 23 |
| Process Technology | 45nm |
| Number of Registers | 30064 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.7 |
| Package Length (mm) | 23 |
| Package Orientation | Yes |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 38 (18x18) |
| Seated Plane Height (mm) | 2.2 |
| External Memory Interface | DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 52 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 266 |
| Package Orientation Marking Type | Dot |
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