XC6SLX25-L1FT256I
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Краткое описание:
FPGA Spartan-6 LX 24K Cells 45nm 256-Pin FTBGA 3.2Gbps
Дополнительная информация
Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Offers 186 maximum user I/Os and 6 DLLs/PLLs. Operates within a -40 °C to 100 °C temperature range. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mounting.
| PCB | 256 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MS-034AAF-1 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 936Kbit |
| Cage Code | 68994 |
| Pin Count | 256 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 1L |
| Package/Case | FTBGA |
| AEC Qualified | No |
| Dedicated DSP | 38 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 24051 |
| Package Width (mm) | 17 |
| Process Technology | 45nm |
| Number of Registers | 30064 |
| Package Description | Fine Pitch Thin Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1 |
| Package Length (mm) | 17 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 76 (18x18) |
| Seated Plane Height (mm) | 1.4 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 52 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 186 |
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