XC6SLX25T-2FGG484C

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XC6SLX25T-2FGG484C - Xilinx
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Краткое описание: FPGA 24051 Cells 45nm 484-Pin FBGA 3.2Gbps Transceiver
Производитель Xilinx
Категория Интегральные схемы (ИС)
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Includes 2 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a pin pitch of 1mm. Operates within a temperature range of 0°C to 85°C.
PCB 484
ECCN 3A991.d
PPAP No
Jedec MS-034AAJ-1
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 936Kbit
Cage Code 68994
Pin Count 484
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Spartan®-6 LXT
Speed Grade 2
Package/Case FBGA
AEC Qualified No
Dedicated DSP 38
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 24051
Package Width (mm) 23
Process Technology 45nm
Transceiver Blocks 2
Number of Registers 30064
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 1.7
Package Length (mm) 23
Package Orientation Yes
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 76 (18x18)
Seated Plane Height (mm) 2.2
External Memory Interface DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 52
Device Number of DLLs/PLLs 6
Maximum Number of User I/Os 250
Package Orientation Marking Type Dot

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