XC6SLX4-2FG900C
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Краткое описание:
FPGA 3840 LC 45nm 900-Pin FBGA 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, featuring 216 Kbit of RAM and 16 dedicated 18x18 multipliers. This 45nm process technology device offers 576 maximum user I/Os and 8 dedicated DSP blocks. It operates at 1.2V, supports transceiver speeds up to 3.2 Gbps, and utilizes SRAM for program memory. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, it is designed for surface mounting and operates within a temperature range of 0°C to 85°C.
| PCB | 900 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 216Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 2 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 8 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 3840 |
| Package Width (mm) | 31 |
| Process Technology | 45nm |
| Number of Registers | 4800 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 16 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 12 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 576 |
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