XC6SLX4-2FGG900I
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Краткое описание:
FPGA 3.2Gbps 3840 Cells 900-Pin FBGA 45nm 1.2V
Дополнительная информация
Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, built on 45nm process technology. Features 216 Kbit RAM, 16 integrated 18x18 multipliers, and 8 dedicated DSP blocks. Offers 576 maximum user I/Os and a transceiver speed of 3.2 Gbps. Housed in a 900-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 31x31mm with a 1mm pin pitch, suitable for surface mounting. Operates across a temperature range of -40°C to 100°C.
| PCB | 900 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 216Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 2 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 8 |
| RoHS Versions | 2011/65/EU |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 3840 |
| Package Width (mm) | 31 |
| Process Technology | 45nm |
| Number of Registers | 4800 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 16 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 12 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 576 |
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