XC6SLX4-3FG900C
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Краткое описание:
FPGA 3840 LC 45nm 900-Pin FBGA 576 I/O
Дополнительная информация
Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, featuring 216 Kbit RAM and 16 integrated 18x18 multipliers. This device operates on 45nm process technology with a 1.2V supply voltage and supports transceiver speeds up to 3.2 Gbps. It offers 576 maximum user I/Os, 8 dedicated DSP slices, and 12 total block RAMs, with 6 DLLs/PLLs. Packaged in a 900-pin FBGA (Fine Pitch Ball Grid Array) with a 31mm x 31mm footprint and 1mm pin pitch, this surface-mount component is rated for 0°C to 85°C operation.
| PCB | 900 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 216Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 8 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 3840 |
| Package Width (mm) | 31 |
| Process Technology | 45nm |
| Number of Registers | 4800 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.75 |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 16 (18x18) |
| Seated Plane Height (mm) | 2.25 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 12 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 576 |
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