Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 2,088 Kbit RAM, 116 multipliers (18x18), and 58 dedicated DSP blocks. Offers 218 user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. This surface-mount device is housed in a 324-pin Chip Scale Ball Grid Array (CSBGA) package with a 0.8mm pin pitch, measuring 15x15x0.9mm. Operates within a temperature range of 0°C to 85°C.
| PCB |
324 |
| ECCN |
3A991.d |
| PPAP |
No |
| Jedec |
MO-275KKAB-1 |
| EU RoHS |
Yes |
| HTS Code |
8542390001 |
| Mounting |
Surface Mount |
| RAM Bits |
2088Kbit |
| Cage Code |
68994 |
| Pin Count |
324 |
| Automotive |
No |
| Lead Shape |
Ball |
| Schedule B |
8542390000 |
| Family Name |
Spartan®-6 LX |
| Speed Grade |
2 |
| Package/Case |
CSBGA |
| AEC Qualified |
No |
| Dedicated DSP |
58 |
| RoHS Versions |
2011/65/EU, 2015/863 |
| Pin Pitch (mm) |
0.8 |
| Programmability |
Yes |
| Package Material |
Plastic |
| Transceiver Speed |
3.2Gbps |
| Basic Package Type |
Ball Grid Array |
| Device Logic Cells |
43661 |
| Package Width (mm) |
15 |
| Process Technology |
45nm |
| Number of Registers |
54576 |
| Package Description |
Chip Scale Ball Grid Array |
| Package Family Name |
BGA |
| Package Height (mm) |
0.9 |
| Package Length (mm) |
15 |
| Package Orientation |
Yes |
| Program Memory Type |
SRAM |
| Radiation Hardening |
No |
| Number of Multipliers |
116 (18x18) |
| Seated Plane Height (mm) |
1.5(Max) |
| External Memory Interface |
DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM |
| Max Operating Temperature |
85°C |
| Min Operating Temperature |
0°C |
| Total Number of Block RAM |
116 |
| Device Number of DLLs/PLLs |
12 |
| Maximum Number of User I/Os |
218 |
| Package Orientation Marking Type |
Dot |