XC6SLX45-2FGG676C

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XC6SLX45-2FGG676C - Xilinx
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Краткое описание: FPGA 43661 Cells 45nm 676-Pin FBGA 3.2Gbps
Производитель Xilinx
Категория Интегральные схемы (ИС)
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 2,088 Kbit RAM, 58 dedicated DSP blocks with 18x18 multipliers, and a transceiver speed of 3.2 Gbps. Offers 358 maximum user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mount applications. Operates within a temperature range of 0°C to 85°C.
PCB 676
ECCN 3A991.d
PPAP No
Jedec MS-034AAL-1
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 2088Kbit
Cage Code 68994
Pin Count 676
Automotive No
Lead Shape Ball
Schedule B 8542390000
Family Name Spartan®-6 LX
Speed Grade 2
Package/Case FBGA
AEC Qualified No
Dedicated DSP 58
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 43661
Package Width (mm) 27
Process Technology 45nm
Number of Registers 54576
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 1.73
Package Length (mm) 27
Package Orientation Yes
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 58 (18x18)
Seated Plane Height (mm) 2.23
External Memory Interface DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 116
Device Number of DLLs/PLLs 12
Maximum Number of User I/Os 358
Package Orientation Marking Type Dot

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