XC6SLX45T-3CSG324C

Производится
XC6SLX45T-3CSG324C - Xilinx
Увеличить
Краткое описание: FPGA 43661 LC 324-Pin CSBGA 45nm 3.2Gbps Transceiver
Производитель Xilinx
Категория Интегральные схемы (ИС)
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. Features 190 maximum user I/Os, 2088 Kbit RAM bits, and 116 (18x18) multipliers. Includes 4 transceiver blocks operating at 3.2 Gbps, 58 dedicated DSP slices, and 1 PCI block. Supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Packaged in a 324-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PCB 324
ECCN EAR99
PPAP No
Jedec MO-275KKAB-1
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 2088Kbit
Cage Code 68994
Pin Count 324
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Spartan®-6 LXT
Speed Grade 3
Package/Case CSBGA
AEC Qualified No
Dedicated DSP 58
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 0.8
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 43661
Package Width (mm) 15
Process Technology 45nm
Transceiver Blocks 4
Number of Registers 54576
Package Description Chip Scale Ball Grid Array
Package Family Name BGA
Package Height (mm) 0.9
Package Length (mm) 15
Package Orientation Yes
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 116 (18x18)
Seated Plane Height (mm) 1.5(Max)
External Memory Interface DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 116
Device Number of DLLs/PLLs 12
Maximum Number of User I/Os 190
Package Orientation Marking Type Dot

Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.