XC6SLX75T-3FG676I
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Краткое описание:
FPGA 74.6K Logic Cells 45nm 676-Pin FBGA 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, featuring 3096 Kbit RAM bits and 132 dedicated DSP slices. This device utilizes 45nm process technology and offers 264 (18x18) multipliers, 8 transceiver blocks operating at 3.2 Gbps, and 1 PCI block. It is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, designed for surface mounting. Operating across a temperature range of -40°C to 100°C, this programmable component provides 348 maximum user I/Os and 172 total Block RAM.
| PCB | 676 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAL-1 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 3096Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | No |
| Lead Shape | Ball |
| PCI Blocks | 1 |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LXT |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 132 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 74637 |
| Package Width (mm) | 27 |
| Process Technology | 45nm |
| Transceiver Blocks | 8 |
| Number of Registers | 93296 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.73 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 264 (18x18) |
| Seated Plane Height (mm) | 2.23 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 172 |
| Device Number of DLLs/PLLs | 18 |
| Maximum Number of User I/Os | 348 |
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