XC6SLX75T-3FGG484C
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Краткое описание:
FPGA 74k Logic Cells 45nm 484-Pin FBGA 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers. Features 3096 Kbit RAM bits, 132 dedicated DSP slices, and 264 18x18 multipliers. This 45nm technology device offers 268 user I/Os and 8 transceiver blocks operating at 3.2 Gbps. Housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package, it supports surface mount installation and operates between 0°C and 85°C.
| PCB | 484 |
| ECCN | 3A991.d |
| PPAP | No |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 3096Kbit |
| Cage Code | 68994 |
| Pin Count | 484 |
| Automotive | No |
| Lead Shape | Ball |
| PCI Blocks | 1 |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LXT |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 132 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 74637 |
| Package Width (mm) | 23 |
| Process Technology | 45nm |
| Transceiver Blocks | 8 |
| Number of Registers | 93296 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.7 |
| Package Length (mm) | 23 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 264 (18x18) |
| Seated Plane Height (mm) | 2.2 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 172 |
| Device Number of DLLs/PLLs | 18 |
| Maximum Number of User I/Os | 268 |
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