XC6SLX75T-3FGG676C

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XC6SLX75T-3FGG676C - Xilinx
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Краткое описание: FPGA 74.6K Logic Cells 3.2Gbps Transceiver 676-Pin FBGA
Производитель Xilinx
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers. Features 3096 Kbit RAM, 264 (18x18) multipliers, and 132 dedicated DSP slices. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PCB 676
ECCN 3A991.d
PPAP No
Jedec MS-034AAL-1
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 3096Kbit
Cage Code 68994
Pin Count 676
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Spartan®-6 LXT
Speed Grade 3
Package/Case FBGA
AEC Qualified No
Dedicated DSP 132
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 74637
Package Width (mm) 27
Process Technology 45nm
Transceiver Blocks 8
Number of Registers 93296
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 1.73
Package Length (mm) 27
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 264 (18x18)
Seated Plane Height (mm) 2.23
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 172
Device Number of DLLs/PLLs 18
Maximum Number of User I/Os 348

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