XC6SLX9-2CSG324C

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XC6SLX9-2CSG324C - Xilinx
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Краткое описание: FPGA 9152 LC, 11440 Reg, 576K RAM, 324-Pin CSBGA, 45nm, 3.2Gbps
Производитель Xilinx
Категория Интегральные схемы (ИС)
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 9152 logic cells and 11440 registers, built on 45nm process technology. Features 576 Kbit RAM, 32 (18x18) multipliers, and 16 dedicated DSP blocks. Offers 200 maximum user I/Os and supports up to 3.2 Gbps transceiver speed. This surface-mount device is housed in a 324-pin Chip Scale Ball Grid Array (CSBGA) package measuring 15x15x0.9mm with a 0.8mm pin pitch. Operates within a temperature range of 0°C to 85°C and includes 6 DLLs/PLLs and 32 Block RAMs.
PCB 324
ECCN 3A991.d
PPAP No
Jedec MO-275KKAB-1
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 576Kbit
Cage Code 68994
Pin Count 324
Automotive No
Lead Shape Ball
Schedule B 8542390000
Family Name Spartan®-6 LX
Speed Grade 2
Package/Case CSBGA
AEC Qualified No
Dedicated DSP 16
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 0.8
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 9152
Package Width (mm) 15
Process Technology 45nm
Number of Registers 11440
Package Description Chip Scale Ball Grid Array
Package Family Name BGA
Package Height (mm) 0.9
Package Length (mm) 15
Package Orientation Yes
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 32 (18x18)
Seated Plane Height (mm) 1.5(Max)
External Memory Interface DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 32
Device Number of DLLs/PLLs 6
Maximum Number of User I/Os 200
Package Orientation Marking Type Dot

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