XC6SLX9-2FTG256C
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Краткое описание:
FPGA Spartan-6 LX 9152 Cells 45nm 256-Pin FTBGA 3.2Gbps
Дополнительная информация
Field Programmable Gate Array (FPGA) with 9152 logic cells and 11440 registers, built on 45nm process technology. Features 576 Kbit RAM, 32 (18x18) multipliers, and 16 dedicated DSP blocks. Offers 186 maximum user I/Os and supports transceiver speeds up to 3.2 Gbps. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mount applications. Operates within a temperature range of 0°C to 85°C.
| PCB | 256 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MS-034AAF-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 576Kbit |
| Cage Code | 68994 |
| Pin Count | 256 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 2 |
| Package/Case | FTBGA |
| AEC Qualified | No |
| Dedicated DSP | 16 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 9152 |
| Package Width (mm) | 17 |
| Process Technology | 45nm |
| Number of Registers | 11440 |
| Package Description | Fine Pitch Thin Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1 |
| Package Length (mm) | 17 |
| Package Orientation | Yes |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 32 (18x18) |
| Seated Plane Height (mm) | 1.4 |
| External Memory Interface | DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 32 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 186 |
| Package Orientation Marking Type | Dot |
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