XC6VCX130T-2FF784I
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Краткое описание:
FPGA Virtex-6 CXT 128K Logic Cells 40nm 784-Pin FCBGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 128,000 logic cells and 160,000 registers, built on 40nm process technology. Features 9504 Kbit RAM, 480 dedicated DSP multipliers (25x18), and 16 transceiver blocks operating at up to 3.75 Gbps. This surface-mount device utilizes a 784-pin Flip Chip Ball Grid Array (FCBGA) package measuring 29mm x 29mm x 2.5mm (Max). Operates within a temperature range of -40°C to 100°C.
| PCB | 784 |
| ECCN | 3A991.d |
| PPAP | No |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 9504Kbit |
| Cage Code | 68994 |
| Pin Count | 784 |
| Automotive | No |
| Lead Shape | Ball |
| PCI Blocks | 2 |
| Schedule B | 8542390000 |
| Family Name | Virtex®-6 CXT |
| Speed Grade | 2 |
| Package/Case | FCBGA |
| AEC Qualified | No |
| Dedicated DSP | 480 |
| Ethernet MACs | 1 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.75Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 128000 |
| Package Width (mm) | 29 |
| Process Technology | 40nm |
| Transceiver Blocks | 16 |
| Number of Registers | 160000 |
| Package Description | Flip Chip Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.5(Max) |
| Package Length (mm) | 29 |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Number of Multipliers | 480 (25x18) |
| Seated Plane Height (mm) | 3.1(Max) |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 264 |
| Maximum Number of User I/Os | 400 |
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