XC6VCX130T-2FFG1156I
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Краткое описание:
FPGA Virtex-6 CXT 128K Logic Cells 40nm 1156-Pin FCBGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 128,000 logic cells and 160,000 registers, built on 40nm process technology. Features 9.5 Mbit of RAM, 480 dedicated DSP multipliers (25x18), 16 transceiver blocks, and 2 PCI blocks. This surface-mount device is housed in a 1156-pin Flip Chip Ball Grid Array (FCBGA) package measuring 35x35mm with a 1mm pin pitch. It offers up to 600 user I/Os and operates within a temperature range of -40°C to 100°C.
| PCB | 1156 |
| ECCN | 3A991.d |
| PPAP | No |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 9504Kbit |
| Cage Code | 68994 |
| Pin Count | 1156 |
| Automotive | No |
| Lead Shape | Ball |
| PCI Blocks | 2 |
| Schedule B | 8542390000 |
| Family Name | Virtex®-6 CXT |
| Speed Grade | 2 |
| Package/Case | FCBGA |
| AEC Qualified | No |
| Dedicated DSP | 480 |
| Ethernet MACs | 1 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 128000 |
| Package Width (mm) | 35 |
| Process Technology | 40nm |
| Transceiver Blocks | 16 |
| Number of Registers | 160000 |
| Package Description | Flip Chip Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.9(Max) |
| Package Length (mm) | 35 |
| Radiation Hardening | No |
| Number of Multipliers | 480 (25x18) |
| Seated Plane Height (mm) | 3.5(Max) |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 264 |
| Maximum Number of User I/Os | 600 |
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