XC6VCX195T-2FF1156C

Производится
XC6VCX195T-2FF1156C - Xilinx
Увеличить
Краткое описание: FPGA 199680 Cells 40nm 1156-Pin FCBGA 3.75Gbps Transceiver
Производитель Xilinx
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 199,680 logic cells and 249,600 registers, built on 40nm process technology. Features 12,384 Kbit RAM bits, 640 dedicated DSP slices, and 640 multipliers (25x18). Includes 16 transceiver blocks operating at up to 3.75 Gbps, 2 PCI blocks, and 1 Ethernet MAC. Packaged in a 1156-pin Flip Chip Ball Grid Array (FCBGA) with a 35mm x 35mm footprint, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PCB 1156
ECCN 3A991.d
PPAP No
EU RoHS No
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 12384Kbit
Cage Code 68994
Pin Count 1156
Automotive No
Lead Shape Ball
PCI Blocks 2
Schedule B 8542390000
Family Name Virtex®-6 CXT
Speed Grade 2
Package/Case FCBGA
AEC Qualified No
Dedicated DSP 640
Ethernet MACs 1
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.75Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 199680
Package Width (mm) 35
Process Technology 40nm
Transceiver Blocks 16
Number of Registers 249600
Package Description Flip Chip Ball Grid Array
Package Family Name BGA
Package Height (mm) 2.9(Max)
Package Length (mm) 35
Program Memory Type Flash
Radiation Hardening No
Number of Multipliers 640 (25x18)
Seated Plane Height (mm) 3.5(Max)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 344
Maximum Number of User I/Os 600

Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.