XC6VCX75T-1FFG784I

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XC6VCX75T-1FFG784I - Xilinx
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Краткое описание: 784-Pin FCBGA FPGA, 74496 Cells, 40nm, 3.75Gbps Transceivers
Производитель Xilinx
Статус производства Производится (ACTIVE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology. Features 5,616 Kbit RAM, 288 dedicated DSP multipliers (25x18), 12 transceiver blocks operating at 3.75 Gbps, and 1 Ethernet MAC. This surface-mount device is housed in a 784-pin Flip Chip Ball Grid Array (FCBGA) package, measuring 29mm x 29mm with a 1mm pin pitch. Operating temperature range is -40 °C to 100 °C.
PCB 784
ECCN 3A991.d
PPAP No
EU RoHS Yes
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 5616Kbit
Cage Code 68994
Pin Count 784
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Virtex®-6 CXT
Speed Grade 1
Package/Case FCBGA
AEC Qualified No
Dedicated DSP 288
Ethernet MACs 1
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.75Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 74496
Package Width (mm) 29
Process Technology 40nm
Transceiver Blocks 12
Number of Registers 93120
Package Description Flip Chip Ball Grid Array
Package Family Name BGA
Package Height (mm) 2.5(Max)
Package Length (mm) 29
Program Memory Type Flash
Radiation Hardening No
Number of Multipliers 288 (25x18)
Seated Plane Height (mm) 3.1(Max)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Total Number of Block RAM 156
Maximum Number of User I/Os 360

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