XC6VCX75T-2FFG784I
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Краткое описание:
74496 LC FPGA 40nm 784-Pin FCBGA 3.75Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology. Features 5,616 Kbit RAM, 288 dedicated DSP slices, and 156 block RAMs. Offers 360 maximum user I/Os, 12 transceiver blocks operating at 3.75 Gbps, and one Ethernet MAC. Packaged in a 784-pin Flip Chip Ball Grid Array (FCBGA) for surface mounting, with dimensions of 29mm x 29mm x 2.5mm (Max). Operates within a temperature range of -40°C to 100°C.
| PCB | 784 |
| ECCN | 3A991.d |
| PPAP | No |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 5616Kbit |
| Cage Code | 68994 |
| Pin Count | 784 |
| Automotive | No |
| Lead Shape | Ball |
| PCI Blocks | 1 |
| Schedule B | 8542390000 |
| Family Name | Virtex®-6 CXT |
| Speed Grade | 2 |
| Package/Case | FCBGA |
| AEC Qualified | No |
| Dedicated DSP | 288 |
| Ethernet MACs | 1 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.75Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 74496 |
| Package Width (mm) | 29 |
| Process Technology | 40nm |
| Transceiver Blocks | 12 |
| Number of Registers | 93120 |
| Package Description | Flip Chip Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.5(Max) |
| Package Length (mm) | 29 |
| Program Memory Type | Flash |
| Radiation Hardening | No |
| Number of Multipliers | 288 (25x18) |
| Seated Plane Height (mm) | 3.1(Max) |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 156 |
| Maximum Number of User I/Os | 360 |
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