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Kintex-7 FPGA, 125K Cells, 28nm, 676-Pin BGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 125,000 logic cells and 157,200 registers, built on 28nm process technology. This device features 1060 Kbit RAM, 400 dedicated DSP slices, and 400 18x25 multipliers. It offers 128 maximum user I/Os and includes 2 Ethernet MACs. Packaged in a 676-pin Lidless FCBGA (27x27mm) for surface mounting, it operates within a 0°C to 85°C temperature range.
| PCB | 676 |
| ECCN | 3A991.d |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 1060Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Kintex-7 |
| Speed Grade | 1 |
| Package/Case | Lidless FCBGA |
| Dedicated DSP | 400 |
| Ethernet MACs | 2 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 125000 |
| Package Width (mm) | 27 |
| Process Technology | 28nm |
| Number of Registers | 157200 |
| Package Description | Flip Chip Lidless Ball Grid Array |
| Package Family Name | Lidless FCBGA |
| Package Height (mm) | 1.84 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Number of Multipliers | 400 (18x25) |
| Seated Plane Height (mm) | 2.34 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 265 |
| Device Number of DLLs/PLLs | 5 |
| Maximum Number of User I/Os | 128 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
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