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FPGA Kintex-7 125K Logic Cells 676-Pin FCBGA 28nm
Дополнительная информация
Field Programmable Gate Array (FPGA) with 125,000 logic cells and 157,200 registers, built on 28nm process technology. Features 1060 Kbit RAM, 400 dedicated DSP slices, and 400 multipliers (18x25). Offers 128 maximum user I/Os and supports differential I/O standards including LVDS, SSTL, and HSTL. This surface-mount device is housed in a 676-pin Fine Pitch Ball Grid Array (FCBGA) package with a 1mm pin pitch, operating within a 0°C to 85°C temperature range.
| PCB | 676 |
| ECCN | 3A991.d |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 1060Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Kintex-7 |
| Speed Grade | 1 |
| Package/Case | FCBGA |
| Dedicated DSP | 400 |
| Ethernet MACs | 2 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 125000 |
| Package Width (mm) | 27 |
| Process Technology | 28nm |
| Number of Registers | 157200 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.4(Max) |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Number of Multipliers | 400 (18x25) |
| Seated Plane Height (mm) | 3(Max) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 265 |
| Device Number of DLLs/PLLs | 5 |
| Maximum Number of User I/Os | 128 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
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