XC7Z030-2FBG484I
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Kintex-7 FPGA, 125K Cells, 28nm, 484-Pin BGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 125,000 logic cells and 157,200 registers, built on 28nm process technology. Features 1060 Kbit RAM, 400 18x25 multipliers, and 400 dedicated DSP slices. This surface-mount device utilizes a 484-pin lidless Flip Chip Ball Grid Array (FCBGA) package measuring 23x23mm with a 1mm pin pitch. Operates across a -40°C to 100°C temperature range and supports up to 128 user I/Os. Includes 2 Ethernet MACs and 5 DLLs/PLLs.
| PCB | 484 |
| ECCN | EAR99 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 1060Kbit |
| Cage Code | 68994 |
| Pin Count | 484 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Kintex-7 |
| Speed Grade | 2 |
| Package/Case | Lidless FCBGA |
| Dedicated DSP | 400 |
| Ethernet MACs | 2 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 125000 |
| Package Width (mm) | 23 |
| Process Technology | 28nm |
| Number of Registers | 157200 |
| Package Description | Flip Chip Lidless Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.84 |
| Package Length (mm) | 23 |
| Program Memory Type | SRAM |
| Number of Multipliers | 400 (18x25) |
| Seated Plane Height (mm) | 2.34 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 265 |
| Device Number of DLLs/PLLs | 5 |
| Maximum Number of User I/Os | 128 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
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