XC7Z030-2FFG676E
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Kintex-7 FPGA 125K Logic Cells, 676-Pin FCBGA, 28nm, 128 I/Os
Дополнительная информация
Field Programmable Gate Array (FPGA) featuring 125,000 logic cells and 157,200 registers, built on 28nm process technology. This device offers 1060 Kbit of RAM, 400 dedicated DSP slices, and 400 multipliers (18x25). It includes 2 Ethernet MACs and supports up to 128 user I/Os with differential standards like LVDS, SSTL, and HSTL. The FPGA operates within a 0°C to 100°C temperature range and is housed in a 676-pin Fine Pitch Ball Grid Array (FCBGA) package measuring 27x27mm.
| PCB | 676 |
| ECCN | 3A991.d |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 1060Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Kintex-7 |
| Speed Grade | 2 |
| Package/Case | FCBGA |
| Dedicated DSP | 400 |
| Ethernet MACs | 2 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 125000 |
| Package Width (mm) | 27 |
| Process Technology | 28nm |
| Number of Registers | 157200 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.4(Max) |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Number of Multipliers | 400 (18x25) |
| Seated Plane Height (mm) | 3(Max) |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 265 |
| Device Number of DLLs/PLLs | 5 |
| Maximum Number of User I/Os | 128 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
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