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Kintex-7 FPGA 125K Logic Cells 28nm 676-Pin FCBGA
Дополнительная информация
Field Programmable Gate Array (FPGA) with 125,000 logic cells and 157,200 registers, built on 28nm process technology. This device features 1060 Kbit of RAM, 400 multipliers (18x25), and 400 dedicated DSP slices. It supports 2 Ethernet MACs and offers 5 DLLs/PLLs, with a total of 265 Block RAMs. The 676-pin Fine Pitch Ball Grid Array (FCBGA) package, measuring 27x27mm with a 1mm pin pitch, is designed for surface mounting and operates within a -40°C to 100°C temperature range.
| PCB | 676 |
| ECCN | 3A991.d |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 1060Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Kintex-7 |
| Speed Grade | 2 |
| Package/Case | FCBGA |
| Dedicated DSP | 400 |
| Ethernet MACs | 2 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 125000 |
| Package Width (mm) | 27 |
| Process Technology | 28nm |
| Number of Registers | 157200 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.4(Max) |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Number of Multipliers | 400 (18x25) |
| Seated Plane Height (mm) | 3(Max) |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 265 |
| Device Number of DLLs/PLLs | 5 |
| Maximum Number of User I/Os | 128 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
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