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Kintex-7 FPGA 350K Logic Cells, 676-Pin BGA, 28nm, 128 I/Os
Дополнительная информация
Field Programmable Gate Array (FPGA) with 350,000 logic cells and 437,200 registers, built on 28nm process technology. Features 2180 Kbit RAM, 900 multipliers (18x25), and 900 dedicated DSP slices. Offers 128 user I/Os and 2 Ethernet MACs. Packaged in a 676-pin Lidless FCBGA (27x27mm) for surface mounting, operating across a -40°C to 100°C temperature range. Supports differential I/O standards including LVDS, SSTL, and HSTL.
| PCB | 676 |
| ECCN | 3A991.d |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 2180Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Kintex-7 |
| Speed Grade | 2 |
| Package/Case | Lidless FCBGA |
| Dedicated DSP | 900 |
| Ethernet MACs | 2 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 350000 |
| Package Width (mm) | 27 |
| Process Technology | 28nm |
| Number of Registers | 437200 |
| Package Description | Flip Chip Lidless Ball Grid Array |
| Package Family Name | Lidless FCBGA |
| Package Height (mm) | 1.84 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Number of Multipliers | 900 (18x25) |
| Seated Plane Height (mm) | 2.34 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 545 |
| Device Number of DLLs/PLLs | 8 |
| Maximum Number of User I/Os | 128 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
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