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Краткое описание:
FPGA Kintex-7 350K Logic Cells 28nm 676-Pin FCBGA
Дополнительная информация
Field-Programmable Gate Array (FPGA) with 350,000 logic cells and 437,200 registers, built on 28nm process technology. Features 2180 Kbit RAM, 900 multipliers (18x25), and 900 dedicated DSP slices. Offers 128 maximum user I/Os and 2 Ethernet MACs. Operates within a -40°C to 100°C temperature range. Packaged in a 676-pin FCBGA (Flip Chip Ball Grid Array) with a 27mm x 27mm footprint, suitable for surface mounting.
| PCB | 676 |
| ECCN | 3A991.d |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 2180Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Kintex-7 |
| Speed Grade | 2 |
| Package/Case | FCBGA |
| Dedicated DSP | 900 |
| Ethernet MACs | 2 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 350000 |
| Package Width (mm) | 27 |
| Process Technology | 28nm |
| Number of Registers | 437200 |
| Package Description | Flip Chip Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.4(Max) |
| Package Length (mm) | 27 |
| Package Orientation | Yes |
| Program Memory Type | SRAM |
| Number of Multipliers | 900 (18x25) |
| Seated Plane Height (mm) | 3(Max) |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 545 |
| Device Number of DLLs/PLLs | 8 |
| Maximum Number of User I/Os | 128 |
| Package Orientation Marking Type | Dot |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
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