XC7Z045-3FFG900E
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Краткое описание:
Kintex-7 FPGA 350K Cells 28nm 900-Pin FCBGA
Дополнительная информация
Field-Programmable Gate Array (FPGA) featuring 350,000 logic cells and 437,200 registers, built on 28nm process technology. This device offers 2180 Kbit of RAM, 545 Block RAMs, and 900 dedicated DSP slices with 900 multipliers (18x25). It supports 128 maximum user I/Os, 2 Ethernet MACs, and 8 DLLs/PLLs, with programmability via SRAM. Packaged in a 900-pin Fine Pitch Ball Grid Array (FCBGA) measuring 31x31mm with a 1mm pin pitch, it is designed for surface mounting and operates within a 0°C to 100°C temperature range.
| PCB | 900 |
| ECCN | 3A991.d |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 2180Kbit |
| Cage Code | 68994 |
| Pin Count | 900 |
| Automotive | Yes |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Kintex-7 |
| Speed Grade | 3 |
| Package/Case | FCBGA |
| Dedicated DSP | 900 |
| Ethernet MACs | 2 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 350000 |
| Package Width (mm) | 31 |
| Process Technology | 28nm |
| Number of Registers | 437200 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 2.75(Max) |
| Package Length (mm) | 31 |
| Program Memory Type | SRAM |
| Number of Multipliers | 900 (18x25) |
| Seated Plane Height (mm) | 3.15 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 545 |
| Device Number of DLLs/PLLs | 8 |
| Maximum Number of User I/Os | 128 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
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