XCP100100S-01
Снят с производства
Краткое описание:
X86 SoC, 25MHz, 256KB RAM, 184-Pin BGA, CMOS
Дополнительная информация
System-On-Chip (SoC) featuring an X86 device core and a CMOS process technology. This 184-pin BGA package offers a 25 MHz maximum clock rate and 256KB RAM. Designed for surface mounting, it operates with a typical supply voltage of 1.8V or 3.3V and supports a UART interface. Ideal for energy and metering, vending machines, and RFID readers, with an operating temperature range of -40°C to 85°C.
| CAN | 0 |
| I2C | 0 |
| I2S | 0 |
| PCB | 184 |
| SPI | 0 |
| USB | 0 |
| ECCN | 5A991 |
| Type | System-On-Chip |
| UART | 1 |
| USART | 0 |
| EU RoHS | Yes |
| Ethernet | 0 |
| HTS Code | 8517690000 |
| Mounting | Surface Mount |
| RAM Size | 256KB |
| Cage Code | 028A6 |
| Pin Count | 184 |
| Lead Shape | Ball |
| Schedule B | 8517690000 |
| Application | Energy and Metering/Vending machines/RFID readers |
| Device Core | X86 |
| Family Name | XChip |
| Package/Case | BGA |
| Maximum Speed | 25MHz |
| RoHS Versions | 2011/65/EU |
| Interface Type | UART |
| Processing Unit | Microcontroller |
| Programmability | No |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Maximum Clock Rate | 25MHz |
| Package Width (mm) | 12 |
| Process Technology | CMOS |
| Package Description | Plastic Ball Grid Array |
| Package Family Name | BGA |
| Package Length (mm) | 12 |
| Program Memory Type | ROMLess |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Number of Programmable I/Os | 3 |
| Typical Operating Supply Voltage | 1.8|3.3V |
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