XPC860PZP80D3
Снят с производства
Увеличить
Краткое описание:
32-bit RISC MPU, 80MHz, 357-Pin BGA, PowerQUICC
Дополнительная информация
32-bit RISC microprocessor featuring a PowerQUICC MPC8xx core, operating at 80 MHz with a 0.32um process technology. This surface-mount device utilizes a 357-pin BGA package with a 1.27mm pin pitch, measuring 25mm x 25mm x 1.35mm. Integrated interfaces include I2C, SPI, and UART, with 16KB instruction cache and 8KB data cache. Designed for a maximum operating supply voltage of 3.6V, it functions within a temperature range of 0°C to 95°C.
| CAN | 0 |
| I2C | 1 |
| I2S | 0 |
| PCB | 357 |
| SPI | 1 |
| USB | 0 |
| ECCN | 5A991 |
| PPAP | No |
| UART | 1 |
| USART | 0 |
| Ethernet | 0 |
| HTS Code | 8542310001 |
| Mounting | Surface Mount |
| Cage Code | H1R01 |
| Pin Count | 357 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542310000 |
| Device Core | PowerQUICC |
| Family Name | PowerQUICC MPC8xx Processor |
| Package/Case | BGA |
| AEC Qualified | No |
| Maximum Speed | 80MHz |
| RoHS Versions | 2002/95/EC |
| Data Bus Width | 32bit |
| Interface Type | I2C/SPI/UART |
| Pin Pitch (mm) | 1.27 |
| Data Cache Size | 8KB |
| Package Material | Plastic |
| Basic Package Type | Ball Grid Array |
| Package Width (mm) | 25 |
| Process Technology | 0.32um |
| Multiply Accumulate | No |
| Number of CPU Cores | 1 |
| Package Description | Plastic Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.35(Max) |
| Package Length (mm) | 25 |
| Radiation Hardening | No |
| Instruction Cache Size | 16KB |
| Seated Plane Height (mm) | 2.05(Max) |
| Max Operating Temperature | 95°C |
| Min Operating Temperature | 0°C |
| Instruction Set Architecture | RISC |
| Max Operating Supply Voltage | 3.465|3.6V |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
