XC6SLX25-3FGG676I
Краткое описание:
FPGA Spartan-6 LX, 24051 LC, 45nm, 676-FBGA, 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit of RAM, 52 block RAMs, and 38 dedicated DSP slices. Offers 498 maximum user I/Os and 76 integrated 18x18 multipliers. Operates with a transceiver speed of 3.2 Gbps and is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package suitable for surface mounting. Extended operating temperature range from -40 °C to 100 °C.
| PCB | 676 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 936Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 3 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 38 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 24051 |
| Package Width (mm) | 27 |
| Process Technology | 45nm |
| Number of Registers | 30064 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.73 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 76 (18x18) |
| Seated Plane Height (mm) | 2.23 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 52 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 498 |
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