XC6SLX25-L1FG676I
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Краткое описание:
FPGA 24051LC 45nm 676-Pin FBGA 3.2Gbps 38DSP
Дополнительная информация
Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Operates on 45nm technology with a transceiver speed of 3.2 Gbps. Housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27x27x1.73mm, for surface mounting. Supports a maximum of 498 user I/Os and operates across a temperature range of -40°C to 100°C.
| PCB | 676 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAL-1 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 936Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 1L |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 38 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 24051 |
| Package Width (mm) | 27 |
| Process Technology | 45nm |
| Number of Registers | 30064 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.73 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 76 (18x18) |
| Seated Plane Height (mm) | 2.23 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 52 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 498 |
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