XC6SLX25T-2FTG256I
Увеличить
Краткое описание:
FPGA, 24051 Cells, 45nm, 256-Pin FTBGA, 3.2Gbps Transceiver
Дополнительная информация
24051 logic cells, 30064 registers, and 936 Kbit RAM characterize this Field Programmable Gate Array (FPGA). Featuring 45nm process technology, it offers 76 18x18 multipliers and 38 dedicated DSP blocks. The device includes 2 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Housed in a 256-pin FTBGA package with a 1mm pin pitch, this surface-mount component supports a maximum of 186 user I/Os and operates within a -40°C to 100°C temperature range.
| PCB | 256 |
| ECCN | EAR99 |
| PPAP | No |
| Jedec | MS-034AAF-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 936Kbit |
| Cage Code | 68994 |
| Pin Count | 256 |
| Automotive | No |
| Lead Shape | Ball |
| PCI Blocks | 1 |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LXT |
| Speed Grade | 2 |
| Package/Case | FTBGA |
| AEC Qualified | No |
| Dedicated DSP | 38 |
| RoHS Versions | 2011/65/EU |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 24051 |
| Package Width (mm) | 17 |
| Process Technology | 45nm |
| Transceiver Blocks | 2 |
| Number of Registers | 30064 |
| Package Description | Fine Pitch Thin Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1 |
| Package Length (mm) | 17 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 76 (18x18) |
| Seated Plane Height (mm) | 1.4 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 52 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 186 |
Если у вас не открывается документ, нажмите, чтобы открыть файл в новой вкладке.
