Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Includes 2 transceiver blocks operating at 3.2 Gbps and 1 PCI block. This surface-mount device is housed in a 484-pin, 23x23mm Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, supporting a maximum of 250 user I/Os. Operates across a temperature range of -40°C to 100°C.
| PCB |
484 |
| ECCN |
3A991.d |
| PPAP |
No |
| EU RoHS |
No |
| HTS Code |
8542390001 |
| Mounting |
Surface Mount |
| RAM Bits |
936Kbit |
| Cage Code |
68994 |
| Pin Count |
484 |
| Automotive |
No |
| Lead Shape |
Ball |
| PCI Blocks |
1 |
| Schedule B |
8542390000 |
| Family Name |
Spartan®-6 LXT |
| Speed Grade |
3 |
| Package/Case |
FBGA |
| AEC Qualified |
No |
| Dedicated DSP |
38 |
| RoHS Versions |
2011/65/EU, 2015/863 |
| Pin Pitch (mm) |
1 |
| Programmability |
Yes |
| Package Material |
Plastic |
| Transceiver Speed |
3.2Gbps |
| Basic Package Type |
Ball Grid Array |
| Device Logic Cells |
24051 |
| Package Width (mm) |
23 |
| Process Technology |
45nm |
| Transceiver Blocks |
2 |
| Number of Registers |
30064 |
| Package Description |
Fine Pitch Ball Grid Array |
| Package Family Name |
BGA |
| Package Height (mm) |
1.7 |
| Package Length (mm) |
23 |
| Program Memory Type |
SRAM |
| Radiation Hardening |
No |
| Number of Multipliers |
76 (18x18) |
| Seated Plane Height (mm) |
2.2 |
| Max Operating Temperature |
100°C |
| Min Operating Temperature |
-40°C |
| Total Number of Block RAM |
52 |
| Device Number of DLLs/PLLs |
6 |
| Maximum Number of User I/Os |
250 |