Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 dedicated 18x18 multipliers, and 38 dedicated DSP blocks. Includes 2 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a package size of 31x31 mm and 1 mm pin pitch. Operates within a temperature range of 0°C to 85°C.
| PCB |
900 |
| ECCN |
3A991.d |
| PPAP |
No |
| Jedec |
MS-034 |
| EU RoHS |
No |
| HTS Code |
8542390001 |
| Mounting |
Surface Mount |
| RAM Bits |
936Kbit |
| Cage Code |
68994 |
| Pin Count |
900 |
| Automotive |
No |
| Lead Shape |
Ball |
| PCI Blocks |
1 |
| Schedule B |
8542390000 |
| Family Name |
Spartan®-6 LXT |
| Speed Grade |
4 |
| Package/Case |
FBGA |
| AEC Qualified |
No |
| Dedicated DSP |
38 |
| RoHS Versions |
2011/65/EU, 2015/863 |
| Pin Pitch (mm) |
1 |
| Programmability |
Yes |
| Package Material |
Plastic |
| Transceiver Speed |
3.2Gbps |
| Basic Package Type |
Ball Grid Array |
| Device Logic Cells |
24051 |
| Package Width (mm) |
31 |
| Process Technology |
45nm |
| Transceiver Blocks |
2 |
| Number of Registers |
30064 |
| Package Description |
Fine Pitch Ball Grid Array |
| Package Family Name |
BGA |
| Package Height (mm) |
1.75 |
| Package Length (mm) |
31 |
| Program Memory Type |
SRAM |
| Radiation Hardening |
No |
| Number of Multipliers |
76 (18x18) |
| Seated Plane Height (mm) |
2.25 |
| Max Operating Temperature |
85°C |
| Min Operating Temperature |
0°C |
| Total Number of Block RAM |
52 |
| Device Number of DLLs/PLLs |
6 |
| Maximum Number of User I/Os |
576 |