XC6SLX25T-4FG900C

Снят с производства
XC6SLX25T-4FG900C - Xilinx
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Краткое описание: FPGA 24051 Cells 45nm 900-Pin FBGA 3.2Gbps Transceiver
Производитель Xilinx
Статус производства Снят с производства (OBSOLETE)

Дополнительная информация

Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 dedicated 18x18 multipliers, and 38 dedicated DSP blocks. Includes 2 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a package size of 31x31 mm and 1 mm pin pitch. Operates within a temperature range of 0°C to 85°C.
PCB 900
ECCN 3A991.d
PPAP No
Jedec MS-034
EU RoHS No
HTS Code 8542390001
Mounting Surface Mount
RAM Bits 936Kbit
Cage Code 68994
Pin Count 900
Automotive No
Lead Shape Ball
PCI Blocks 1
Schedule B 8542390000
Family Name Spartan®-6 LXT
Speed Grade 4
Package/Case FBGA
AEC Qualified No
Dedicated DSP 38
RoHS Versions 2011/65/EU, 2015/863
Pin Pitch (mm) 1
Programmability Yes
Package Material Plastic
Transceiver Speed 3.2Gbps
Basic Package Type Ball Grid Array
Device Logic Cells 24051
Package Width (mm) 31
Process Technology 45nm
Transceiver Blocks 2
Number of Registers 30064
Package Description Fine Pitch Ball Grid Array
Package Family Name BGA
Package Height (mm) 1.75
Package Length (mm) 31
Program Memory Type SRAM
Radiation Hardening No
Number of Multipliers 76 (18x18)
Seated Plane Height (mm) 2.25
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Total Number of Block RAM 52
Device Number of DLLs/PLLs 6
Maximum Number of User I/Os 576