XC6SLX25T-4FGG676C
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Краткое описание:
FPGA 24051 Cells 45nm 676-Pin FBGA, 3.2Gbps Transceiver
Дополнительная информация
Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Includes 2 transceiver blocks operating at 3.2 Gbps, 1 PCI block, and 52 block RAMs. This surface-mount device is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, measuring 27mm x 27mm x 1.73mm. Operates within a temperature range of 0°C to 85°C.
| PCB | 676 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 936Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | No |
| Lead Shape | Ball |
| PCI Blocks | 1 |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LXT |
| Speed Grade | 4 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 38 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 24051 |
| Package Width (mm) | 27 |
| Process Technology | 45nm |
| Transceiver Blocks | 2 |
| Number of Registers | 30064 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.73 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 76 (18x18) |
| Seated Plane Height (mm) | 2.23 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 52 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 498 |
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