Field Programmable Gate Array (FPGA) with 3840 logic cells and 45nm process technology. Features 225 pins in a Chip Scale Ball Grid Array (CSBGA) package, measuring 13mm x 13mm x 0.9mm with a 0.8mm pin pitch. Offers 132 user I/Os, 4800 registers, 216 Kbit RAM, 16 (18x18) multipliers, and 8 dedicated DSP blocks. Operates with a 1.2V supply and supports transceiver speeds up to 3.2 Gbps, with an operating temperature range of -40°C to 100°C.
| PCB |
225 |
| ECCN |
EAR99 |
| PPAP |
No |
| EU RoHS |
Yes |
| HTS Code |
8542390001 |
| Mounting |
Surface Mount |
| RAM Bits |
216Kbit |
| Cage Code |
68994 |
| Pin Count |
225 |
| Automotive |
No |
| Lead Shape |
Ball |
| Schedule B |
8542390000 |
| Family Name |
Spartan®-6 LX |
| Speed Grade |
2 |
| Package/Case |
CSBGA |
| AEC Qualified |
No |
| Dedicated DSP |
8 |
| RoHS Versions |
2011/65/EU, 2015/863 |
| Pin Pitch (mm) |
0.8 |
| Programmability |
Yes |
| Package Material |
Plastic |
| Transceiver Speed |
3.2Gbps |
| Basic Package Type |
Ball Grid Array |
| Device Logic Cells |
3840 |
| Package Width (mm) |
13 |
| Process Technology |
45nm |
| Number of Registers |
4800 |
| Package Description |
Chip Scale Ball Grid Array |
| Package Family Name |
BGA |
| Package Height (mm) |
0.9 |
| Package Length (mm) |
13 |
| Program Memory Type |
SRAM |
| Radiation Hardening |
No |
| Number of Multipliers |
16 (18x18) |
| Seated Plane Height (mm) |
1.4(Max) |
| Max Operating Temperature |
100°C |
| Min Operating Temperature |
-40°C |
| Total Number of Block RAM |
12 |
| Device Number of DLLs/PLLs |
6 |
| Maximum Number of User I/Os |
132 |