XC6SLX4-2FGG676C
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Краткое описание:
FPGA 3840 LC 45nm 676-FBGA 498 I/O 216K RAM 3.2Gbps
Дополнительная информация
Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, built on 45nm process technology. Features 216 Kbit RAM, 12 Block RAMs, and 8 dedicated DSP slices. Offers 16 integrated 18x18 multipliers and 6 DLLs/PLLs. Operates at 1.2V with a transceiver speed of 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a pin pitch of 1mm.
| PCB | 676 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 216Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 2 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 8 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 3840 |
| Package Width (mm) | 27 |
| Process Technology | 45nm |
| Number of Registers | 4800 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.73 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 16 (18x18) |
| Seated Plane Height (mm) | 2.23 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Total Number of Block RAM | 12 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 498 |
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