XC6SLX4-2FGG676I
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Краткое описание:
FPGA 3840 Cells 45nm 676-Pin FBGA Surface Mount
Дополнительная информация
Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, built on 45nm process technology. Features 216 Kbit RAM, 12 block RAMs, and 8 dedicated DSP slices. Offers 16 integrated 18x18 multipliers and 6 DLLs/PLLs for advanced signal processing. Operates with a transceiver speed of 3.2 Gbps and supports SRAM programming. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a temperature range of -40°C to 100°C.
| PCB | 676 |
| ECCN | 3A991.d |
| PPAP | No |
| Jedec | MS-034AAL-1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Mounting | Surface Mount |
| RAM Bits | 216Kbit |
| Cage Code | 68994 |
| Pin Count | 676 |
| Automotive | No |
| Lead Shape | Ball |
| Schedule B | 8542390000 |
| Family Name | Spartan®-6 LX |
| Speed Grade | 2 |
| Package/Case | FBGA |
| AEC Qualified | No |
| Dedicated DSP | 8 |
| RoHS Versions | 2011/65/EU, 2015/863 |
| Pin Pitch (mm) | 1 |
| Programmability | Yes |
| Package Material | Plastic |
| Transceiver Speed | 3.2Gbps |
| Basic Package Type | Ball Grid Array |
| Device Logic Cells | 3840 |
| Package Width (mm) | 27 |
| Process Technology | 45nm |
| Number of Registers | 4800 |
| Package Description | Fine Pitch Ball Grid Array |
| Package Family Name | BGA |
| Package Height (mm) | 1.73 |
| Package Length (mm) | 27 |
| Program Memory Type | SRAM |
| Radiation Hardening | No |
| Number of Multipliers | 16 (18x18) |
| Seated Plane Height (mm) | 2.23 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Total Number of Block RAM | 12 |
| Device Number of DLLs/PLLs | 6 |
| Maximum Number of User I/Os | 498 |
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